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INTEGRATED CIRCUITS
DATA SHEET
SAA7152 Digital Video Comb Filter (DCF)
Product specification File under Integrated Circuits, IC02 August 1996
Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
FEATURES * Comb filter circuit for luminance and chrominance separation * Applicable for standards - PAL B/G, M and N - PAL 4.43 (525 lines, 60 Hz) - NTSC M and N - NTSC 4.43 (50 and 60 Hz) * Luminance and chrominance bypasses with short delay in case of no filtering * Line-locked system clock; CCIR-compatible * I2C-bus controlled
GENERAL DESCRIPTION The CMOS digital comb filter circuit is located between video analog-to-digital converters and the video multistandard decoder SAA7151B (not applicable for SAA7191B). The two-dimensional filtering is only appropriate for standard signals from a source with constant phase relationship between subcarrier signal and horizontal frequency. The comb-filter has to be switched off for VTR-signals and for separate VBS and C signals. In VCR and S-Video operation the luminance low-pass and the chrominance bandpass parts can still be used for noise reduction purposes. The processing delay is: 21 x LL27 clocks in active mode, or 3 x LL27 in short delay bypass mode (BYPS = 1)
QUICK REFERENCE DATA SYMBOL VDD IP Vi Vo LL27 Tamb PARAMETER supply voltage (pins 11, 34, 44) total supply current input levels output levels typical system clock frequency operating ambient temperature range - MIN. 4.5 5.0 85 TYP. MAX. 5.5 180 V mA UNIT
TTL-compatible TTL-compatible - 0 27 - - 70 MHz C
ORDERING INFORMATION EXTENDED TYPE NUMBER SAA7152 Note 1. SOT187-2; 1997 January 06. 44 PACKAGE PINS PIN POSITION PLCC MATERIAL plastic CODE SOT187 (1)
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
BLOCK DIAGRAM
SAA7152
handbook, full pagewidth
+5 V VDDD1 to VDDD3
SAA7152
CVBS(7 -0) 20 to 13
NLIN, LLEN LINE DELAY 1
11, 34, 44 CFRQ BANDPASS FILTER 1 OUTPUT INTERFACE MULTIPLEXER LINE DELAY 2 CFRQ NLIN, LLEN COMB FILTER LOGIC (MED) CCMB, TAPS REGISTER 35 to 42 COUT(7-0) BYPS 25 to 32 YOUT(7-0)
INPUT INTERFACE CIN(7 -0) 10 to 3
luminance bypass
CSEL
LL27
2
CLOCK BUFFER
clk
BANDPASS FILTER 2 TAPS, CFRQ
control bits I 2 C-bus SDA SCL 23 I 2 C-BUS CONTROL LOW-PASS FILTER chrominance bypass 21 SP RESN 12, 33, 43 VSSD1 to V SSD3
MEH423-1
ADDER AND LIMITER
YCMB
24
1
22 AP
Fig.1 Block diagram.
August 1996
3
Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
PINNING SYMBOL RESN LL27 CIN0 CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 VDD1 VSS1 CVBS0 CVBS1 CVBS2 CVBS3 CVBS4 CVBS5 CVBS6 CVBS7 SP AP SDA SCL YOUT7 YOUT6 YOUT5 YOUT4 YOUT3 YOUT2 YOUT1 YOUT0 VSS2 VDD2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 ground 2 (0 V) +5 V supply input 2 luminance (Y) output data bits 7 to 0 connected to ground (shift pin for testing) connected to ground (action pin for testing) I2C-bus data line I2C-bus clock line CVBS input data bits 0 to 7 +5 V supply input ground 1 (0 V) chrominance input data bits CIN0 to CIN7 PIN reset input; active low line-locked system clock input (27 MHz) DESCRIPTION
SAA7152
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
SYMBOL COUT7 COUT6 COUT5 COUT4 COUT3 COUT2 COUT1 COUT0 VSS3 VDD3 35 36 37 38 39 40 41 42 43 44
PIN
DESCRIPTION
chrominance (C) output data bits 7 to 0
ground 3 (0 V) +5 V supply input 3
COUT3
COUT4
COUT5
COUT6
COUT7
YOUT2 30
YOUT0
V DD2
39
38
37
36
35
34
33
V SS2
handbook, full pagewidth
32
31
YOUT1
29
YOUT3
COUT2 40 COUT1 41 COUT0 42 V SS3 VDD3
RESN LL27 CIN0 CIN1 CIN2 CIN3
28 YOUT4 27 YOUT5 26 YOUT6 25 YOUT7 24 SCL
43 44 1 2 3 4 5 6
SAA7152
23 SDA 22 AP 21 SP 20 CVBS7 19 CVBS6 18 CVBS5
7 CIN4
8 CIN5
9 CIN6
10 CIN7
11 V DD1
12 V SS1
13 CVBS0
14 CVBS1
15 CVBS2
16 CVBS3
17 CVBS4
MEH422
Fig.2 Pin configuration.
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
handbook, full pagewidth
CVBS
ADC
Y TDA8708A
CVBS(7-0)
YOUT(7-0)
CVBS/Y
DMSD
DCF
DIGITAL VIDEO COMB FILTER CHROMA SAA7152 YUV SAA7151B
ADC
UV TDA8709A
CIN(7-0) LL27 clock
COUT(7-0)
CUV CREF LL27 LFCO
CGC
SAA7157
MEH557-1
Fig.3 System environment.
August 1996
6
Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
I2C-BUS FORMAT S S SLAVE ADDRESS A SUBADDRESS (1) DATA P X SLAVE ADDRESS = = = = = = = A SUBADDRESS A DATA0 A ........ DATAn
SAA7152
A
P
start condition 1011 0010 (B2 h) acknowledge, generated by the slave subaddress byte (Table 1) data byte (Table 1) stop condition read/write control bit X = 0, order to write (the circuit is slave receiver) X = 1, order to read (the circuit is slave transmitter)
Note 1. If more than 1 byte DATA are transmitted, then auto-increment of the subaddress is performed.
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
Table 1 I2C-bus; subaddress and data bytes for writing (after X = 0 in address byte) DATA FUNCTION Controls 00 SUBADDRESS D7 BYPS D6 CSEL D5 CCMB D4 YCMB D3 TAPS D2 CFRQ
SAA7152
D1 NLIN
D0 LLEN
Function of the bits of Table 1: BYPS CSEL CCMB YCMB TAPS CFRQ NLIN LLEN Select bypass with a short delay; all other 0 = no bypass functions are disabled: 1 = comb filter bypassed (delay is 3 LLC) Input mode select: Select comb filtering Enable chrominance substruction from CVBS signal: Selects tap for switching Y and C to adder: Select centre frequency and matching factor of chrominance filter: Select delay (number of lines): Selects the number of clocks for each line delay: 0 = CVBS selected 1 = Y/C selected 0 = chrominance is bandpassed 1 = chrominance is comb-filtered 0 = disabled, CVBS/Y signal is only low-passed 1 = enabled (chrominance trap or comb filtering) 0 = for bandpass/low-pass combination 1 = for comb filter active 0 = 4.43 MHz 1 = 3.58 MHz 0 = 4-line comb filter for standard PAL 1 = 2-line filter for standard NTSC 0 = 1728 clocks (625 lines; 50 Hz) 1 = 1716 clocks (525 lines; 60 Hz)
August 1996
8
Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
MEH424
handbook, full pagewidth
0 -6 video (dB) -12 -18 -24 -30 -36 -42 -48 0 2 4 6 8 10 12 14 f (MHz) 16
Fig.4 Frequency response of bandpass filters 1 and 2 with CFRQ-bit = 1.
MEH425
andbook, full pagewidth
0 -6 video (dB) -12 -18 -24 -30 -36 -42 -48 0 2 4 6 8 10 12 14 f (MHz) 16
Fig.5 Frequency response of bandpass filters 1 and 2 with CFRQ-bit = 0.
August 1996
9
Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
MEH426
ook, full pagewidth
0 -6 video (dB) -12 -18 -24 -30 -36 -42 -48 0 2 4 6 8 10 12 14 f (MHz) 16
Fig.6 Frequency response of low-pass filter with CFRQ-bit = 1.
MEH427
handbook, full pagewidth
0 -6 video (dB) -12 -18 -24 -30 -36 -42 -48 0 2 4 6 8 10 12 14 f (MHz) 16
Fig.7 Frequency response of low-pass filter with CFRQ-bit = 0.
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI VO Ptot Tstg Tamb VESD Note voltage on all inputs voltage on all outputs (IO max = 20 mA) total power dissipation storage temperature range operating ambient temperature range electrostatic handling(1) for all pins PARAMETER supply voltage (pins 11, 34, 44) MIN. -0.5 -0.5 -0.5 - -65 0 - 7.0 VDD + 0.5 VDD + 0.5 1.0 150 70 2000 MAX.
SAA7152
UNIT V V V W C C V
1. Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor; inputs and outputs are protected against electrostatic discharge in normal handling. Normal precautions appropriate to handle MOS devices is recommended (see "Handling MOS Devices"). CHARACTERISTICS VDD1 to VDD3 = 5 V; Tamb = 0 to 70 C and measurements taken in Fig.1 unless otherwise specified. SYMBOL VDD IDD PARAMETER supply voltage range (pins 11, 34, 44) total supply current (pins 11, 34, 44) VDD = 5 V; inputs LOW; outputs not connected CONDITIONS - MIN. 4.5 TYP. 5.0 85 MAX. 5.5 180 UNIT V mA
I2C-bus, SDA and SCL (pins 23 and 24) VIL VIH I23, 24 IACK VOL VIL VIH VIL VIH Ileak CI tSU.DAT tHD.DAT input leakage current input capacitance input data set-up time input data hold time data inputs clock inputs Fig.8 other input voltages input voltage LOW input voltage HIGH input current output current on pin 23 output voltage at acknowledge acknowledge I23 = 3 mA LOW HIGH LOW HIGH -0.5 3 - 3 - -0.5 2.4 -0.5 2.0 - - - 11 3 - - - - - - - - - - - - - - 1.5 VDD+0.5 10 - 0.4 V V A mA V
Data and clock inputs (pins 2 to 10 and pins 13 to 20) LL27 input voltage (pin 2) 0.6 VDD+0.5 0.8 VDD+0.5 10 8 10 - - V V V V A pF pF ns ns
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SAA7152
SYMBOL
PARAMETER
CONDITIONS
MIN. - - - - -
TYP.
MAX.
UNIT
Data outputs (pins 25 to 32 and pins 35 to 42) VOL VOH CL tOH tOD output voltage LOW output voltage HIGH load capacitor Fig.8 CL = 8 pF CL = 25 pF Fig.8 note 1 tLL27H / tLL27 35 40 - - - 50 - - 39 60 5 6 ns % ns ns 3 - - 32 ns ns 0 2.4 8 0.6 VDD 25 V V pF
Timing of data outputs output signal hold time from positive edge of LL27 output delay from positive edge of LL27
Line locked clock input LL27 (pin 2) tLL27 tp tr tf Note 1. tSU, tHD, tOH and tOD include tr and tf. cycle time duty factor rise time fall time
handbook, full pagewidth
t LL27 t LL27 H 2.4 V
clock input LL27
1.5 V 0.6 V t SU t HD not valid tf tr
input data
2.0 V 0.8 V t OD t OH not valid 2.4V
output data 0.6 V
MEH556-1
Fig.8 Data input and output timing.
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
PACKAGE OUTLINE PLCC44: plastic leaded chip carrier; 44 leads
SAA7152
SOT187-2
eD y X A ZE
eE
39
29 28
40
bp b1 wM
44
1
pin 1 index
E
HE A
e
A4 A1 (A 3)
k
6
18 k 1 Lp 7 e D HD 17 ZD B vMB detail X vM A
0
5 scale
10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT
mm
A
4.57 4.19
A1 min.
0.51
A3
0.25
A4 max.
3.05
bp
0.53 0.33
b1
0.81 0.66
D (1)
E (1)
e
eD
eE
HD
HE
k
k1 max.
0.51
Lp
1.44 1.02
v
0.18
w
0.18
y
0.10
Z D(1) Z E (1) max. max.
2.16 2.16
16.66 16.66 16.00 16.00 17.65 17.65 1.22 1.27 16.51 16.51 14.99 14.99 17.40 17.40 1.07
45 o
0.180 inches 0.020 0.01 0.165
0.630 0.630 0.695 0.695 0.048 0.057 0.021 0.032 0.656 0.656 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.12 0.590 0.590 0.685 0.685 0.042 0.040 0.013 0.026 0.650 0.650
Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT187-2 REFERENCES IEC 112E10 JEDEC MO-047AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all PLCC and QFP packages. The choice of heating method may be influenced by larger PLCC or QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering PLCC Wave soldering techniques can be used for all PLCC packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow.
SAA7152
* The package footprint must incorporate solder thieves at the downstream corners. QFP Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). METHOD (PLCC AND QFP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
August 1996
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Philips Semiconductors
Product specification
Digital Video Comb Filter (DCF)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA7152
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
August 1996
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